Electronics Forum | Tue Jun 15 12:54:34 EDT 2004 | jsmith01
It seems like the break is happening between the sn and ni. The parts are dull in appearance will not take solder even with an iron after they come off so it leads me to believe that there is only ni left on the part. The parts are liquidous for ab
Electronics Forum | Tue Jul 20 02:36:03 EDT 2004 | yukim
Hi, The solder paste is SE5-M951X-9. Comparing with the previous one we used, we are having much more tombstoning problems. The reflow profile is such as: room temp to 140C: 85~95 sec 140 to 170 C: 80 sec 170 to 200 C: 20 ~ 23 sec Above 200 C: 44 ~
Electronics Forum | Mon Aug 09 17:02:32 EDT 2004 | arminski
Hi Shean, Thanks for the analysis. "Your product looks like it may have non-solder-mask-defined pads." Yes. It is a NSMD PCB. "Does there appear to be any residues on the bare boards, and/or, BGA components prior to applying the solder paste?"
Electronics Forum | Thu Sep 02 14:26:22 EDT 2004 | frankracine
Thanks Russ, very interesting. Are you working with a printer, PNP, reflow and wave? Did you change apertures in your stencils with lead free ? Concerning reflow, do you have a 5 zones, 7 zones ... ? Are you using the same alloys for solder paste
Electronics Forum | Tue Aug 31 11:57:03 EDT 2004 | Kris
Hi Any body have any issues soldering tin lead solder paste with lead free terminations ? Components are leaded devices and chip components have read the theoritical discussions on the forum, need to know if any body has seen any real issues tod
Electronics Forum | Thu Sep 02 22:39:58 EDT 2004 | davef
Comments are: * Few of us use IR reflow. It has been replaced by convection or a combination of convection and IR. * Follow the recommendations of you paste supplier in determining the initial thermal recipe for your oven. * Look here to learn more
Electronics Forum | Thu Sep 30 09:49:54 EDT 2004 | davef
Armin Habba could be considering a situation where: after they convert to no-lead they receive components with lead-bearing solderability protection from their component supplier. This could happen when: * Supplier has not converted to no-lead. * O
Electronics Forum | Fri Oct 01 16:12:00 EDT 2004 | palmerg
As long as they're good. Have you guys had any free "help" from so called engineers that turned into a costly waste of time (both in resources and line down). I have heard some real horror stories from former co-workers. I haven't heard this about th
Electronics Forum | Fri Nov 19 16:38:15 EST 2004 | grayman
Hi, We only use alcohol for cleaning stencil but it gives us best result even with no clean solder paste. We are using Branson.Furthermore, we have fine pitch components.Try cleaning the tank maybe there are solder accomolation in the tank or try in
Electronics Forum | Mon Dec 06 12:27:01 EST 2004 | Scott B
We are currently reviewing a design which has a leadless chip scale package with a solder thermal pad on the underside. The application notes for the device specify use of a no-clean solder paste as the gap under the device will prevent cleaning. Is
